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| MBRS120T3 Preferred Device Surface Mount Schottky Power Rectifier This device employs the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. Features http://onsemi.com * * * * * * * SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE, 20 VOLTS Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop (0.55 Volts Max @ 1.0 A, TJ = 25C) Excellent Ability to Withstand Reverse Avalanche Energy Transients Guard-Ring for Stress Protection Pb-Free Package is Available SMB CASE 403A PLASTIC Mechanical Characteristics * Case: Epoxy, Molded * Weight: 95 mg (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * Lead and Mounting Surface Temperature for Soldering Purposes: * 260C Max. for 10 Seconds Cathode Polarity Band Leads are Readily Solderable MARKING DIAGRAM AYWW B12G G MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (TL = 115C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction Temperature Symbol VRRM VRWM VR IF(AV) IFSM Value 20 Unit V B12 = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) 1.0 40 A A ORDERING INFORMATION Device Package SMB SMB (Pb-Free) Shipping 2500/Tape & Reel 2500/Tape & Reel TJ -65 to +125 C MBRS120T3 MBRS120T3G Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. (c) Semiconductor Components Industries, LLC, 2005 1 August, 2005 - Rev. 6 Publication Order Number: MBRS120T3/D MBRS120T3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead (TL = 25C) Symbol RJL Value 12 Unit C/W ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 1) (iF = 1.0 A, TJ = 25C) Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 25C) (Rated dc Voltage, TJ = 100C) 1. Pulse Test: Pulse Width = 300 s, Duty Cycle 2.0%. VF iR 1.0 10 0.6 V mA i F , INSTANTANEOUS FORWARD CURRENT (AMPS 1 0.7 0.5 0.3 0.2 I R , REVERSE CURRENT (mA) TC = 100C 0.1 0.07 0.05 0.03 0.02 0.1 TC = 25C 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 100 50 30 20 10 5 3 2 1 0.5 0.3 0.2 0.1 0.05 0.03 0.02 0.01 TJ = 125C 100C 75C 25C 0 4 8 12 16 20 24 28 32 36 40 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Typical Reverse Current http://onsemi.com 2 MBRS120T3 200 180 C, CAPACITANCE (pF) 160 140 120 100 80 60 40 20 0 0 4 8 12 16 20 24 28 32 36 40 NOTE: TYPICAL CAPACITANCE AT 0 V = 160 pF VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Capacitance PF(AV) , AVERAGE POWER DISSIPATION (WATTS) I F(AV) , AVERAGE FORWARD CURRENT (AMPS) 10 9 8 7 6 5 4 3 2 1 0 30 40 50 60 70 80 90 100 TC, CASE TEMPERATURE (C) 110 120 130 SQUARE WAVE DC RATED VOLTAGE APPLIED RJC = 12C/W TJ = 125C 5 TJ = 125C 4 3 2 1 0 5 CAPACITANCE LOAD IPK IAV = 20 10 SQUARE WAVE DC 0 1 2 3 4 5 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 4. Current Derating (Case) Figure 5. Power Dissipation http://onsemi.com 3 MBRS120T3 PACKAGE DIMENSIONS SMB PLASTIC PACKAGE CASE 403A-03 ISSUE E HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MILLIMETERS NOM MAX 2.13 2.41 0.10 0.15 2.03 2.11 0.23 0.30 3.56 3.81 4.32 4.57 5.44 5.59 1.02 1.27 0.51 REF MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF MAX 0.095 0.006 0.083 0.012 0.150 0.180 0.220 0.050 b D A L L1 c A1 SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 MBRS120T3/D |
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